Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects
نویسندگان
چکیده
This paper presents gold passivated dense NiW mechanically flexible interconnects (MFIs) for advanced 3D heterogeneous IC integration. The MFIs are fabricated with a pitch as small as 25 μm, a maximum height of 65 μm, and can be engineered to provide a wide range of mechanical stiffness and vertical range of motion within the elastic region. The compliance for the fabricated MFIs is measured to be as high as 9.26 mm/N with a maximum vertical deformation of over 65 μm within the elastic range. Integration of the MFIs with through-silicon-vias (TSVs) is also reported.
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تاریخ انتشار 2016